產(chǎn)品照片 |
類別 |
產(chǎn)品規(guī)格 |
額定電流 |
封裝尺寸 |
規(guī)格書下載 |
備注 |
 |
Wire Wound SMD Power Inductor |
0.47uH~10uH |
3.75A~0.87A |
2.5*2.0*1.0mm |
CMLW252010S |
材質(zhì):鎳鋅 |
 |
Wire Wound SMD Power Inductor |
0.33uH~10uH |
3.0A~0.62A |
2.0*1.6*1.0mm |
CMLW201610S |
材質(zhì):鎳鋅 |
 |
Wire Wound SMD Power Inductor |
0.22~22uH |
22A~2A |
4.0*4.0*2.0mm |
CMLW4020P |
材質(zhì):合金粉 |
 |
Wire Wound SMD Power Inductor |
0.33~22uH |
11.5A~1.2A |
4.0*4.0*1.2mm |
CMLW4012P |
材質(zhì):合金粉 |
 |
Wire Wound SMD Power Inductor |
0.22~10uH |
10A~1.45A |
3.0*3.0*1.2mm |
CMLW3012P |
材質(zhì):合金粉 |
 |
Wire Wound SMD Power Inductor |
0.24uH~10uH |
7.2A~1.0A |
2.5*2.0*1.0mm |
CMLW252010P |
材質(zhì):合金粉 |
 |
Wire Wound SMD Power Inductor |
0.24~10uH |
8.5A~1.35A |
2.5*2.0*1.2mm |
CMLW252012P |
材質(zhì):合金粉 |
 |
Wire Wound SMD Power Inductor |
0.24~10uH |
5.5A~0.95A |
2.0*1.6*1.0mm |
CMLW201610P |
材質(zhì):合金粉 |